Experimental investigation of roll bond liquid cooling plates for server chip heat dissipation
| Autor: | Hu, Haozhong, Chen, Chaomeng, Li, Chao, Pan, Minqiang |
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| Zdroj: | In Applied Thermal Engineering 25 May 2023 226 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Hu, Haozhong, Chen, Chaomeng, Li, Chao, Pan, Minqiang |
|---|---|
| Zdroj: | In Applied Thermal Engineering 25 May 2023 226 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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Full Text from ScienceDirect