Effect of integrated copper pad on the performance of boiling-driven wickless thermal ground plane
| Autor: | Moon, Joo Hyun, Wang, Xiaomeng, Fadda, Dani, Shin, Dong Hwan, Lee, Jungho, You, Seung M. |
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| Zdroj: | In Applied Thermal Engineering 25 November 2021 199 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect