Layer-by-layer assembly of boron arsenide and copper nanoflake-based aramid nanofibers for thermoconductive electromagnetic interference shielding materials with superior mechanical flexibility and flame retardancy
| Autor: | Cuong Nguyen, Van, Nguyen Pham, Vi, Thien Nguyen, Chi, Hoang Ai Pham, Le, Khiem Nguyen, Duy, Thi Kieu Lien, Mai, Canh Vu, Minh |
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| Zdroj: | In Journal of Industrial and Engineering Chemistry 25 October 2024 138:492-501 |
| Databáze: | ScienceDirect |
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