Enhancement of Cu-to-Cu bonding property by residual stress in Cu substrate
| Autor: | Wang, Hung, Chen, Ping-Hsuan, Kung, Cheng-Hao, Chang, Po-Kai, Chiu, Shang-Jui, Lin, Yan-Gu, Wang, Chan-Meng, Wu, Albert T. |
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| Zdroj: | In Materials Characterization August 2024 214 |
| Databáze: | ScienceDirect |
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