Effect of Cetyl Trimethyl ammonium bromide (CTAB) amount on the Nanoindentation creep behaviour of Sn-cu-Y2O3 nanocomposite Lead-free solder
| Autor: | Mallik, Manila, Das, Karabi, Ghosh, Rabindra Nath, Das, Siddhartha |
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| Zdroj: | In Materials Characterization June 2024 212 |
| Databáze: | ScienceDirect |
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