Ultrasonic-enhanced silver‑indium transient liquid phase bonding in advancing rapid and low-temperature packaging
| Autor: | Song, Jiaqi, Zhang, Donglin, Chen, Xin, Hu, Shizun, Zhao, Xiuchen, Lee, Chin C., Huo, Yongjun |
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| Zdroj: | In Materials Characterization April 2024 210 |
| Databáze: | ScienceDirect |
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