Novel Ag-Cu foam sheet with multi-layer composite structure for high performance joining of SiC power chips
| Autor: | Yin, Changhao, Wumaeraili, Kuxitaer, Zhang, Yu, Wu, Yongchao, Zhang, Jiahe, Guo, Wei, Zhu, Ying, Song, Xiaoguo, Jia, Qiang, Zhang, Hongqiang |
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| Zdroj: | In Materials Characterization March 2024 209 |
| Databáze: | ScienceDirect |
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