Intermetallic compound growth behavior and mechanical performance in Sn58Bi/Cu solder joint bearing Mg particles incorporation during thermal aging
| Autor: | Huang, Xi, Zhang, Liang, Zhang, Jia-Min, Chen, Chen, Lu, Xiao, Sun, Lei |
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| Zdroj: | In Materials Characterization February 2024 208 |
| Databáze: | ScienceDirect |
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