Analysis of (Al,Cr,Nb,Ta,Ti)-nitride and -oxynitride diffusion barriers in Cu-Si interconnects by 3D-Secondary Ion Mass Spectrometry
| Autor: | Kretschmer, Andreas, Bohrn, Fabian, Hutter, Herbert, Pitthan, Eduardo, Tran, Tuan Thien, Primetzhofer, Daniel, Mayrhofer, Paul Heinz |
|---|---|
| Zdroj: | In Materials Characterization March 2023 197 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect