Effect of solder composition on the growth behavior of interfacial compounds on (001) Cu and polycrystalline Cu during aging
Autor: | Dong, Chong, Guo, Tianhao, Ma, Haoran, Ma, Haitao, Wang, Yunpeng |
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Zdroj: | In Materials Characterization December 2022 194 |
Databáze: | ScienceDirect |
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