Work of adhesion and reactive wetting in SnPb/Cu,Ni and SnBi/Cu,Ni soldering systems
| Autor: | Griffiths, Samuel, Wedi, Andre, Schmitz, Guido |
|---|---|
| Zdroj: | In Materials Characterization August 2021 178 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Griffiths, Samuel, Wedi, Andre, Schmitz, Guido |
|---|---|
| Zdroj: | In Materials Characterization August 2021 178 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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Full Text from ScienceDirect