Microstructure, thermo-physical and mechanical properties of spray-deposited Si–30Al alloy for electronic packaging application
Autor: | Wang, Feng, Xiong, Baiqing, Zhang, Yongan, Zhu, Baohong, Liu, Hongwei, Wei, Yanguang |
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Zdroj: | In Materials Characterization 2008 59(10):1455-1457 |
Databáze: | ScienceDirect |
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