Thermal reliabilities of Sn-0.5Ag-0.7Cu-0.1Al2O3/Cu solder joint
| Autor: | WU, Jie *, HUANG, Guo-qiang *, XUE, Song-bai *, XUE, Peng, XU, Yong * |
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| Zdroj: | In Transactions of Nonferrous Metals Society of China October 2022 32(10):3312-3320 |
| Databáze: | ScienceDirect |
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