Cu–Al interfacial compounds and formation mechanism of copper cladding aluminum composites
| Autor: | CHU, Di, ZHANG, Jian-yu, YAO, Jin-jin, HAN, Yan-qiu, WU, Chun-jing |
|---|---|
| Zdroj: | In Transactions of Nonferrous Metals Society of China November 2017 27(11):2521-2528 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect