Investigating the effect of binder and aggregate application rates on performance of chip seals via digital image processing and sweep tests
| Autor: | Kumbargeri, Yogesh Shamsunder, Boz, Ilker, Kutay, M. Emin |
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| Zdroj: | In Construction and Building Materials 20 October 2019 222:213-221 |
| Databáze: | ScienceDirect |
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