Investigations on the mechanism of silica particle removal during the Cu buff cleaning process
| Autor: | Liu, Pengzhan, Hong, Seokjun, Jeon, Sanghuck, Lee, Jaewon, Kwak, Donggeon, Wada, Yutaka, Hiyama, Hirokuni, Hamada, Satomi, Kim, Taesung |
|---|---|
| Zdroj: | In Colloids and Surfaces A: Physicochemical and Engineering Aspects 20 October 2021 627 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect