Plasma-activated direct bonding of patterned silicon-on-insulator wafers to diamond-coated wafers under vacuum

Autor:	Can, Uryan Isik, Bayram, Baris
Zdroj:	In Diamond & Related Materials August 2014 47:53-57
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect