Development of copper-boron nitride core-shell structured fillers and surface treatment for thermally conductive composites
| Autor: | Lee, Wondu, Park, Sang Duck, Kim, Jihoon, Park, Dabin, Whang, Dongmok, Kim, Jooheon |
|---|---|
| Zdroj: | In Journal of Alloys and Compounds 25 October 2024 1003 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect