Interfacial reactions and critical current density of Cu-sheathed Cu-doped MgB2 wire with Ti diffusion barrier
| Autor: | Srivastava, N., Mehrotra, S., Búran, M., Hušek, I., Sharma, D., Kováč, P., Santra, S. |
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| Zdroj: | In Journal of Alloys and Compounds 5 December 2023 966 |
| Databáze: | ScienceDirect |
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