Kinetics of Cu6Sn5 and Cu3Sn intermetallic compounds growth and isothermal solidification during Cu-Sn transient liquid phase sintering process
| Autor: | Peng, Xianwen, Wang, Yue, Wang, Wanli, Ye, Zheng, Yang, Jian, Huang, Jihua |
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| Zdroj: | In Journal of Alloys and Compounds 15 July 2023 949 |
| Databáze: | ScienceDirect |
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