Investigate the heat conduction between film and substrate during sputtering process by multi-layer structure NiCr/NiSi film thermocouples
| Autor: | Liu, Zhihui, Wang, Qizhen, Zhang, Xin, Xing, Bo, Yang, Yumeng, Wang, Hualin, Jiang, Weiwei, Cui, Yunxian, Ding, Wanyu |
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| Zdroj: | In Journal of Alloys and Compounds 25 April 2023 941 |
| Databáze: | ScienceDirect |
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