Interfacial heat transfer and microstructural analyses of a Bi- 5% Sb lead-free alloy solidified against Cu, Ni and low-C steel substrates

Autor: Soares, Thiago, Cruz, Clarissa, Xavier, Marcella, Reyes, Rodrigo V., Bertelli, Felipe, Garcia, Amauri, Spinelli, José E., Cheung, Noé
Zdroj: In Journal of Alloys and Compounds 15 April 2021 860
Databáze: ScienceDirect