Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint
| Autor: | Cheng, Jinxuan, Hu, Xiaowu, Li, Qinglin |
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| Zdroj: | In Journal of Alloys and Compounds 15 August 2020 832 |
| Databáze: | ScienceDirect |
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