Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn–5Sb solder composites on Cu substrate

Autor: Dele-Afolabi, T.T., Azmah Hanim, M.A., Ojo-Kupoluyi, O.J., Calin, R.
Zdroj: In Journal of Alloys and Compounds 5 November 2019 808
Databáze: ScienceDirect