Mg2Si-based thermoelectric compounds with enhanced fracture toughness by introduction of dual nanoinclusions
| Autor: | Kim, Gwansik, Rim, Hyun Jun, Lee, Hwijong, Kim, Jeongmin, Roh, Jong Wook, Lee, Kyu Hyoung, Lee, Wooyoung |
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| Zdroj: | In Journal of Alloys and Compounds 15 September 2019 801:234-238 |
| Databáze: | ScienceDirect |
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