Influence of dual ceramic nanomaterials on the solderability and interfacial reactions between lead-free Sn-Ag-Cu and a Cu conductor
| Autor: | Jung, Do-Hyun, Sharma, Ashutosh, Jung, Jae-Pil |
|---|---|
| Zdroj: | In Journal of Alloys and Compounds 30 April 2018 743:300-313 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect