Au–Sn bonding material for the assembly of power integrated circuit module
| Autor: | Zhu, Z.X., Li, C.C., Liao, L.L., Liu, C.K., Kao, C.R. |
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| Zdroj: | In Journal of Alloys and Compounds 25 June 2016 671:340-345 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Zhu, Z.X., Li, C.C., Liao, L.L., Liu, C.K., Kao, C.R. |
|---|---|
| Zdroj: | In Journal of Alloys and Compounds 25 June 2016 671:340-345 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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Full Text from ScienceDirect