Crystallographic characterization and growth behavior of (Cu,Ni,Pd)6Sn5 intermetallic compound in Ni(P)/Pd/Au/SnAgCu/Cu assembled solder joint
| Autor: | Tseng, Chien-Fu, Ho, Cheng-Ying, Lee, Joseph, Duh, Jenq-Gong |
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| Zdroj: | In Journal of Alloys and Compounds 5 July 2014 600:21-28 |
| Databáze: | ScienceDirect |
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