Evaluation of mechanical properties of low-Ag ball grid array solder joints using a high-speed ball shear test
| Autor: | Bui, Q.V., Jung, S.B. |
|---|---|
| Zdroj: | In Journal of Alloys and Compounds 15 March 2014 589:590-595 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Bui, Q.V., Jung, S.B. |
|---|---|
| Zdroj: | In Journal of Alloys and Compounds 15 March 2014 589:590-595 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect