Effective suppression of interfacial intermetallic compound growth between Sn–58 wt.% Bi solders and Cu substrates by minor Ga addition
| Autor: | Lin, Shih-kang, Nguyen, Trong Lan, Wu, Shu-chang, Wang, Yu-hsiang |
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| Zdroj: | In Journal of Alloys and Compounds 15 February 2014 586:319-327 |
| Databáze: | ScienceDirect |
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