Effects of Ni-coated Carbon Nanotubes addition on the electromigration of Sn–Ag–Cu solder joints
| Autor: | Yang, Zhongbao, Zhou, Wei, Wu, Ping |
|---|---|
| Zdroj: | In Journal of Alloys and Compounds 25 December 2013 581:202-205 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Yang, Zhongbao, Zhou, Wei, Wu, Ping |
|---|---|
| Zdroj: | In Journal of Alloys and Compounds 25 December 2013 581:202-205 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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Full Text from ScienceDirect