Investigation of amorphous Ni–Al–N film as diffusion barrier between Cu and SiO 2
| Autor: | Liu, B.T., Chen, J.H., Li, X.H., Wang, K.M., Li, M., Zhao, D.Y., Yang, L., Zhao, Q.X., Ma, L.X., Zhang, X.Y. |
|---|---|
| Zdroj: | In Journal of Alloys and Compounds 2011 509(31):8093-8096 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect