Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn–9Zn binary eutectic solder alloy
| Autor: | Das, S.K., Sharif, A., Chan, Y.C., Wong, N.B., Yung, W.K.C. |
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| Zdroj: | In Journal of Alloys and Compounds 2009 481(1):167-172 |
| Databáze: | ScienceDirect |
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