A novel packaging method for FBG temperature sensors based on ultrasonic-assisted soldering technology
| Autor: | Yang, Xueli, Liu, Mingyao, Song, Han, Rao, Jun, Wu, Yihang |
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| Zdroj: | In Sensors and Actuators: A. Physical 1 August 2024 373 |
| Databáze: | ScienceDirect |
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