Secondary embossing method for the capsulation of high-sensitive flexible piezoresistive sensors

Autor: Bai, Xiaofeng, Du, Yu, Gai, Chenhui, Guo, Yang, Liu, Ying, Huang, Yao, Xu, Hong, Wu, Daming, Sun, Jingyao
Zdroj: In Sensors and Actuators: A. Physical 1 March 2022 335
Databáze: ScienceDirect