Secondary embossing method for the capsulation of high-sensitive flexible piezoresistive sensors
Autor: | Bai, Xiaofeng, Du, Yu, Gai, Chenhui, Guo, Yang, Liu, Ying, Huang, Yao, Xu, Hong, Wu, Daming, Sun, Jingyao |
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Zdroj: | In Sensors and Actuators: A. Physical 1 March 2022 335 |
Databáze: | ScienceDirect |
Externí odkaz: |