Highly sensitive wafer-level packaged MEMS magnetic field sensor based on magnetoelectric composites
| Autor: | Marauska, S., Jahns, R., Kirchhof, C., Claus, M., Quandt, E., Knöchel, R., Wagner, B. |
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| Zdroj: | In Sensors & Actuators: A. Physical 15 January 2013 189:321-327 |
| Databáze: | ScienceDirect |
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