InP dies transferred onto silicon substrate for optical interconnects application
| Autor: | Kostrzewa, M., Di Cioccio, L., Zussy, M., Roussin, J.C., Fedeli, J.M., Kernevez, N., Regreny, P., Lagahe-Blanchard, Ch., Aspar, B. |
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| Zdroj: | In Sensors & Actuators: A. Physical 2006 125(2):411-414 |
| Databáze: | ScienceDirect |
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