Detection of joining mechanisms at different locations of the wire/substrate interface during ultrasonic wire bonding via a PZT-based sensor array
| Autor: | Long, Yangyang, Arndt, Matthias, Sun, Chen, Dencker, Folke, Wurz, Marc, Twiefel, Jens |
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| Zdroj: | In Journal of Materials Processing Tech. November 2022 |
| Databáze: | ScienceDirect |
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