Large-scale anodic bonding mediated by a liquid tin solder

Autor: Claure Ramirez, Ernesto, Klemenčič, Robert, Klučka, Martin, Lang, Britta, Beisel, Samuel, Altorfer, Heinz, Koebel, Matthias M., Malfait, Wim J.
Zdroj: In Journal of Materials Processing Tech. August 2017 246:69-76
Databáze: ScienceDirect