Large-scale anodic bonding mediated by a liquid tin solder
Autor: | Claure Ramirez, Ernesto, Klemenčič, Robert, Klučka, Martin, Lang, Britta, Beisel, Samuel, Altorfer, Heinz, Koebel, Matthias M., Malfait, Wim J. |
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Zdroj: | In Journal of Materials Processing Tech. August 2017 246:69-76 |
Databáze: | ScienceDirect |
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