Hybrid erosive jet micro-milling of sintered ceramic wafers with and without copper-filled through-holes

Autor: Kowsari, K., Sookhaklari, M.R., Nouraei, H., Papini, M., Spelt, J.K.
Zdroj: In Journal of Materials Processing Tech. April 2016 230:198-210
Databáze: ScienceDirect