Low temperature Cu joining by in situ reduction-sintering of CuO nanoparticle for high power electronics
| Autor: | Zuo, Yang, Carter-Searjeant, Sadie, Green, Mark, Mills, Liam, Mannan, Samjid H. |
|---|---|
| Zdroj: | In Advanced Powder Technology October 2020 31(10):4135-4144 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect