A comprehensive solution for simulating ultra-shallow junctions: From high dose/low energy implant to diffusion annealing

Autor: Boucard, F., Roger, F., Chakarov, I., Zhuk, V., Temkin, M., Montagner, X., Guichard, E., Mathiot, D.
Zdroj: In Materials Science & Engineering B 2005 124:409-414
Databáze: ScienceDirect