Optimisation of a combined transient-ion-drift/rapid thermal annealing process for copper detection in silicon

Autor: Belayachi, A. *, Heiser, T., Schunck, J.P., Bourdais, S., Bloechl, P., Huber, A., Kempf, A.
Zdroj: In Materials Science & Engineering B 2003 102(1):218-221
Databáze: ScienceDirect