Optimisation of a combined transient-ion-drift/rapid thermal annealing process for copper detection in silicon
Autor: | Belayachi, A. *, Heiser, T., Schunck, J.P., Bourdais, S., Bloechl, P., Huber, A., Kempf, A. |
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Zdroj: | In Materials Science & Engineering B 2003 102(1):218-221 |
Databáze: | ScienceDirect |
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