Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging
| Autor: | Wang, Yonggang *, Zhang, Guangneng, Ma, Jusheng |
|---|---|
| Zdroj: | In Materials Science & Engineering B 2002 94(1):48-53 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Wang, Yonggang *, Zhang, Guangneng, Ma, Jusheng |
|---|---|
| Zdroj: | In Materials Science & Engineering B 2002 94(1):48-53 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
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