Microstructure evolution and deformation behaviour of Sn-xBi-1Ag Solder alloys: Influences of Bi content
| Autor: | Hu, X.J., Sun, W., Liao, J.L., Xian, J.W., Zeng, G. |
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| Zdroj: | In Materials Science & Engineering A September 2024 910 |
| Databáze: | ScienceDirect |
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