Low-dislocation-density ultrafine lamellar structure buffering triples ductility in Cu-8wt.%Sn alloy treated by rotary swaging and appropriate annealing

Autor: Zhao, Lun, Chen, Liangguo, Luo, Boyi, Liang, Yuanxin, Shi, Junqi, Zhang, Shunran, Lin, Zhongze, Shi, Peijian, Zheng, Tianxiang, Zhou, Bangfei, Guo, Yifeng, Li, Qiang, Liu, Chunmei, Shen, Zhe, Ding, Biao, Zhong, Yunbo
Zdroj: In Materials Science & Engineering A January 2024 889
Databáze: ScienceDirect