Low-dislocation-density ultrafine lamellar structure buffering triples ductility in Cu-8wt.%Sn alloy treated by rotary swaging and appropriate annealing
Autor: | Zhao, Lun, Chen, Liangguo, Luo, Boyi, Liang, Yuanxin, Shi, Junqi, Zhang, Shunran, Lin, Zhongze, Shi, Peijian, Zheng, Tianxiang, Zhou, Bangfei, Guo, Yifeng, Li, Qiang, Liu, Chunmei, Shen, Zhe, Ding, Biao, Zhong, Yunbo |
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Zdroj: | In Materials Science & Engineering A January 2024 889 |
Databáze: | ScienceDirect |
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