Ultrasonic-assisted soldering of SiC ceramic and aluminum alloy with a commercial inactive Sn3.0Ag0.5Cu solder
Autor: | Zhao, Di, Zhao, Chenchen, Xiu, Ziyang, Yan, Jiuchun |
---|---|
Zdroj: | In Materials Science & Engineering A January 2024 889 |
Databáze: | ScienceDirect |
Externí odkaz: |