Ultrasonic-assisted soldering of SiC ceramic and aluminum alloy with a commercial inactive Sn3.0Ag0.5Cu solder
| Autor: | Zhao, Di, Zhao, Chenchen, Xiu, Ziyang, Yan, Jiuchun |
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| Zdroj: | In Materials Science & Engineering A January 2024 889 |
| Databáze: | ScienceDirect |
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