Interfacial microstructure evolution and properties of Sn-0.3Ag-0.7Cu–xSiC solder joints
| Autor: | Yin, Limeng, Zhang, Zhongwen, Su, Zilong, Zhang, Hehe, Zuo, Cunguo, Yao, Zongxiang, Wang, Gang, Zhang, Long, Zhang, Yupeng |
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| Zdroj: | In Materials Science & Engineering A 30 March 2021 809 |
| Databáze: | ScienceDirect |
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