Microstructural evolution and growth kinetics of interfacial compounds in TiAl/Ti3SiC2 diffusion bonding joints
| Autor: | Wang, Qi, Chen, Guo-qing, Wang, Kang, Fu, Xue-song, Zhou, Wen-long |
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| Zdroj: | In Materials Science & Engineering A 22 May 2019 756:149-155 |
| Databáze: | ScienceDirect |
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