Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain
| Autor: | Zhang, Q.K., Hu, F.Q., Song, Z.L., Zhang, Z.F. |
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| Zdroj: | In Materials Science & Engineering A 31 July 2017 701:187-195 |
| Databáze: | ScienceDirect |
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